Request InfoFINETECHFinetech USA’s FINEPLACER femto 2 die-bonding platform is designed for advanced packaging and bonding in automated precision manufacturing, with a focus on high yield. With a placement accuracy of ± 0.5 μm at three sigma and maximum process flexibility, the machine supports a wide range of applications at chip and wafer level. The prototype-to-production system accommodates applications that migrate from process and product development to automated low-volume production environments. 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