Metrology Inspection Capability
Apr 2016Rudolph TechnologiesRequest Info
WILMINGTON, Mass., April 28, 2016 — Rudolph Technologies Inc. has added high-speed 3D metrology capabilities to its NSX series of flexible inspection and measurement platforms for process development and control of die-level interconnects.
The capability incorporates a three-segment optical range, giving users the flexibility to control both smaller micro bumps and larger, traditional solder bumps with a single inspection and metrology platform.
Data is collected in seconds from millions of bumps, then analyzed by the Discover Software’s analysis database.