Request InfoOnto InnovationWILMINGTON, Mass., April 28, 2016 — Rudolph Technologies Inc. has added high-speed 3D metrology capabilities to its NSX series of flexible inspection and measurement platforms for process development and control of die-level interconnects. The capability incorporates a three-segment optical range, giving users the flexibility to control both smaller micro bumps and larger, traditional solder bumps with a single inspection and metrology platform. 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