Thermal Imaging Camera
May 2016FLIR Systems Inc.
WILSONVILLE, Ore., April 29, 2016 — Flir Systems Inc. has announced the X8000sc series of thermal imaging cameras with lock-in, transient and pulse capabilities to perform advanced inspections such as nondestructive testing or stress mapping that resolve temperature differences as low as 1 mK.
The cameras detect internal defects though target excitation and the observation of thermal differences on a target’s surface. They also detect defects and points of failure in composites, solar cells, bridges and electronics, as well as enabling thermal mapping of stress when performing materials testing.
The devices are designed to provide the best thermal measurement performance for scientists, engineers and researchers with thermal images up to 1280 × 1024 pixels, enabling users to see the smallest of details with excellent measurement accuracy.