Surface Processing Platforms
May 2016SUSS MicroTec AGRequest Info
GARCHING BEI MUNCHEN, Germany, May 26, 2016 — Suss Microtec Lithography GmbH has announced the LI Laser Imaging series, a versatile surface processing platform.
Process capabilities of the system range from submicron patterning of resist coated substrates to micro-ablation, photo-chemistry treatment and metrology. A lens focusing set is included in the base system. It is also possible to process small wafer pieces and add a second laser source of choice. Multiple patterning modes are available.
The system is suited for academic and industrial R&D facilities. Main applications include nano- and 3D structuring for high-resolution wafer lithography, micro-optical components, sensors, microfluidic devices and photo mask manufacturing.