Automated Metrology System
Jul 2016EV Group (EVG)Request Info
ST. FLORIAN, Austria, July 13, 2016 — EV Group has announced the EVG 50 automated metrology system, designed to support stringent manufacturing requirements for advanced packaging, MEMS and photonics applications.
The EVG 50 performs high-resolution, nondestructive, multilayer thickness and topography measurement, as well as void detection, in bonded wafer stacks and photoresists used in optical lithography.
The system measures layers down to 2 μm in thickness, inspects up to 1 million points and achieves throughputs of up to 55 300-mm wafers/hour. This combination of extremely high resolution and high throughput provides cost-efficient full-wafer inspection that enables device manufacturers to improve their wafer bonding and lithography processes, as well as achieve higher yields.