Inspection and Metrology Systems
Sep 2016Rudolph TechnologiesRequest Info
WILMINGTON, Mass., Sept. 16, 2016 — Rudolph Technologies Inc. has announced the Firefly and Dragonfly inspection and metrology systems for advanced semiconductor manufacturing.
Both systems leverage newly designed optical and imaging systems optimized for defect type, size and maximum throughput.
The Firefly system is designed for high-resolution inspection in front- and back-end applications. It is designed to detect defects smaller than one micron in multiple applications including fan-out wafer level packaging, CMOS image sensors, microelectromechanical systems and radio frequency sensors.
The Dragonfly system is designed for high-speed 2D inspection in advanced packaging processes.It targets large die, multichip advanced packaging applications, with 2D inspection sensitivity down to 2 μm, a modular approach to integrated metrology and defect analysis software. The system quickly detects, images and analyzes defects on a broad range of devices and packages. The Dragonfly system will deliver critical in-process inspection and metrology for wafer reconstitution, after develop, after etch and at each level of redistribution.