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FLIP-CHIP PHOTODIODES

Photonics Spectra
May 2000
First Sensor Inc.Request Info
 
Pacific Silicon Sensor Inc. has developed a method to produce flip-chip photodiodes with both contacts on the same face, allowing the device to have a front face without bond wires or other contact areas. The process moves aluminum from the front face to the rear under a controlled temperature gradient by a conductive channel of P-type material. The technology is available for 4-in. N-type silicon wafers in the resistivity range up to 50 (omega)-cm.


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