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Epoxy Potting and Encapsulating Compound

Photonics.com
Aug 2017
EpoxySet Inc.Request Info
 
LINCOLN, R.I., Aug. 24, 2017 — Epoxy Potting and Encapsulating CompoundThe EP-207 thermally conductive epoxy potting and encapsulating compound from EpoxySet Inc. is designed for electronics and heat dissipating devices.

The room temperature curing system is UL-94V0 yellow-card-listed with excellent electrical insulating properties and high dielectric strength. It is low viscosity and creates strong seals to metals, ceramics, glass and many engineered plastics. Numerous packaging options are available including dual barrel cartridges, pints, quarts, gallons as well as premixed and frozen syringes.

The EP-207 is ideal for thermal cycling applications from −55 to 125° C. A slight degree of flexibility is featured for resistance to mechanical and vibrational shock. The low-cure shrinkage epoxy will not damage intricate circuits and components during cure.


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