Request InfoChromasens GmbHKONSTANZ, Germany, Aug. 30, 2017 — The 3DPIXA 3D color stereoscopic camera from Chromasens GmbH is designed for the automated optical inspection of equipped and unequipped printed circuit boards. By combining 2D and 3D visualizations in a single camera, the 3DPIXA is suitable for printed circuitboards with elevations of different heights. It features an optical resolution of 5 µm for 2D color visualization and of 1 µm for 3D image capture. High resolution is a basic requirement for the inspection of wire bonds with a thickness of <1 mm. 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