Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn

Inspection System

Photonics.com
Oct 2017
Rudolph TechnologiesRequest Info
 
WILMINGTON, Mass., Oct. 9, 2017 — Inspection SystemTruebump Technology in the Dragonfly Inspection System from Rudolph Technologies Inc. provides fast, accurate and repeatable 3D metrology for all advanced packaging bumping applications, from copper pillar to microbumps, and even large C4 bumps.

Truebump Technology is 3× faster and 25 percent more repeatable than Rudolph’s previous generation tool. The Dragonfly system’s high-volume throughput, combined with accuracy and repeatability, enable further adoption of stacked devices in advanced packaging applications that fuel today’s drive for thinner and lighter products that deliver more capability in a smaller form factor.

The Dragonfly system is designed for high-volume 2D inspection and 3D bump metrology on a single platform for the advanced packaging industry.


REQUEST INFO ABOUT THIS PRODUCT

* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address:
Address 2:
City:
State/Province:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
ProductsTruebump TechnologyDragonfly Inspection SysteminspectionAmericasindustrial

Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2017 Photonics Media
x We deliver – right to your inbox. Subscribe FREE to our newsletters.
X
Are you interested in this product?
If you'd like Rudolph Technologies to reach out to you with more information about this product, please supply your email and they will contact you.

Email Address:
Stop showing me this for the remainder of my visit