Request InfoPixelinkGloucester, OTTAWA, Oct. 27, 2017 — Pixelink has announced USB3.1 Gen 2 interface support on its machine vision and microscopy cameras. Pixelink’s M-Series and PL-D line of cameras will be built to integrate with USB 3.1 Gen 2 specifications. With a bus speed mode of 10 GB/s, the USB 3.1 Gen 2 interface can deliver more than double the throughput of the current existing USB 3.0. All Pixelink 3.1 Gen 2 cameras will be fully backward compatible with existing USB3.0 and USB2.0 applications. The USB3.1 Gen 2 interface supports a maximum of 20 V at 5 amps for a total of 100 W of power, an increase from the 4.5 W...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra February 2023 IssueWeld CameraThe XVC-S100 Weld Camera from Xiris Automation Inc. is an all-digital welding camera for submerged arc applications. 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