Request InfoIndium Corp.CLINTON, N.Y., March 26, 2018 — Precision gold alloy (AuSn) solder preforms from Indium Corp. are designed specially to meet the challenges facing radio frequency and power semiconductor devices as they continue to get smaller with increasing power density and power ratings. Depending on the alloy, gold-based solders have a melting point ranging from 280 to 1064 °C, making it compatible with subsequent reflow processes. In addition, gold-based solders are resistant to corrosion, providing high thermal fatigue resistance and joint strength. 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