Aug 2000O.C. White Co.Request Info
The O.C. White Co. offers the benchtop 3-D BGA Inspection System with three-chip camera technology. Its lens design provides 50x to 200x magnification and its metal-halide light source includes four fiber optic light bundles with white light at 5500 K for daylight illumination without blind spots. The three-chip camera technology is designed for clear, sharp 3-D images displayed on a high-resolution 15-in. color monitor. The system is suitable for inspection of solder joints and paste prints, surface structure, placement alignment, presence of flux and microcracking.