Request InfoO.C. White Co.The O.C. White Co. offers the benchtop 3-D BGA Inspection System with three-chip camera technology. Its lens design provides 50x to 200x magnification and its metal-halide light source includes four fiber optic light bundles with white light at 5500 K for daylight illumination without blind spots. The three-chip camera technology is designed for clear, sharp 3-D images displayed on a high-resolution 15-in. color monitor. The system is suitable for inspection of solder joints and paste prints, surface structure, placement alignment, presence of flux and microcracking.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 1/12/2023A Proven, Portable, and PIC-Based Methodology for Cultivating a Next-Generation WorkforceWith the passage of the CHIPS and Science Act and growing demand for photonic integrated circuit technology, the semiconductor industry is once again gaining momentum. But even as the U.S. rebuilds...Photonics.com 7/20/2023Motorized and Calibrated Lenses for Machine Vision ApplicationsMany applications have benefited from motorized varifocal lenses that allow automatic or remote adjustment of focus distance and field of view. Applications may need to change the focal length or...Photonics.com 6/30/2021European Photonics Manufacturing Services Funded by ECThis event is supported by the European initiatives presented and is moderated by EPIC, the European Photonics Industry Consortium. The European Commission is helping companies access the...Photonics.com 3/27/2024Precision Planning: Simplified Laser Scanning with Predictive SoftwareConventional controllers for laser scan systems do not allow to predict the actual path of the laser beam on the work piece. A tedious process of testing different parameters and delay settings...