Request InfoMaster Bond Inc.A two-component epoxy adhesive has been introduced by Master Bond Inc. EP30ND cures at room temperature, or more rapidly at elevated temperatures with a 4-to-1 mix ratio, weight or volume. It develops bonding strength of more than 2000 psi at room temperature, with dimensional stability and low shrinkage. The adhesive bond is resistant to thermal cycling and chemicals, including water, oil and organic solvents from -60 to +250 °F. EP30ND bonds to metal, glass, ceramics, wood, vulcanized rubber and plastic.See full productRelated content from Photonics MediaARTICLESPhotonics Spectra January 2024 IssueHybrid Photoresist Helps Meet Demand for Smaller ChipsTo achieve performance gains in microelectronics, semiconductor size continues to shrink, with feature sizes now in the sub-10-nm range. 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