Mar 2001Remtec Inc.Request Info
Remtec Inc. says it has improved its PowerPlug technology, which consists of thermal via fills for use in the fabrication of metallized ceramic substrates, chip carriers and packages. The company says that these solid, copper-plated vias improve the performance of microelectronic circuitry. They provide a uniform thermal environment and allow designers to reduce package size and increase integration level and circuit density. Features include thermal resistance as low as 2 °C/W, high thermal conductivity and an electrical resistance as low as 0.38 mV.