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3D Solder Paste Inspection Solution

Test Research Inc.Request Info
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TAIPEI, Taiwan, Aug. 23, 2023 — The TR7007Q SII from Test Research Inc. is a high-performance 3D solder paste inspection system designed to enhance production efficiency in the electronics manufacturing industry.

The system offers up to 50% faster inspection compared to previous models and is equipped with a high-resolution 21-MP camera for accurate measurements. It is versatile and can reliably inspect various components like bumps, flux, mini LED solder, and bare boards. Its improved accuracy and stability ensure precise solder measurements and reduced false calls. The system supports data exchange for closed-loop operations and is compatible with various industry standards like IPC-Hermes-9852, IPC-CFX, and IPC-DPMX
Aug 2023
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ProductsTR7007Q SIITest ResearchoptoelectronicsimagingindustrialAsia-Pacificinspectionsolder paste inspection system

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