3D X-Ray Measurement System
Carl Zeiss X-ray Microscopy LLCRequest Info
The Xradia 620 Versa RepScan® 3D from Zeiss is a submicron-resolution, 3D, nondestructive imaging solution for inspection and measurement that accelerates time to market for advanced integrated circuit packages.
The device provides rich volumetric and linear measurements of buried features in advanced packages that cannot be achieved with existing methods such as physical cross-section, 2D x-ray, and micro-CT. The result is higher-accuracy engineering data that can be used to reduce development and yield learning cycles of advanced packages.
The system supports design verification, product development, process optimization, and quality assurance/control of complex fine-pitch 3D architectures, including 2.5D interposers, high-bandwidth memory stacks with through silicon vias and microbumps, package-on-package interconnects, and ultra-thin memory with multiple chips in a stack.
https://www.zeiss.com/microscopy
/Buyers_Guide/Carl_Zeiss_X-ray_Microscopy_LLC/c16229
Published: October 2019
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