3D X-Ray Measurement System
Carl Zeiss X-ray Microscopy LLCRequest Info
PLEASANTON, Calif., Oct. 1, 2019 — 
The Xradia 620 Versa RepScan® 3D from Zeiss is a submicron-resolution, 3D, nondestructive imaging solution for inspection and measurement that accelerates time to market for advanced integrated circuit packages.
The device provides rich volumetric and linear measurements of buried features in advanced packages that cannot be achieved with existing methods such as physical cross-section, 2D x-ray, and micro-CT. The result is higher-accuracy engineering data that can be used to reduce development and yield learning cycles of advanced packages.
The system supports design verification, product development, process optimization, and quality assurance/control of complex fine-pitch 3D architectures, including 2.5D interposers, high-bandwidth memory stacks with through silicon vias and microbumps, package-on-package interconnects, and ultra-thin memory with multiple chips in a stack.
https://www.zeiss.com/microscopy
/Buyers_Guide/Carl_Zeiss_X-ray_Microscopy_LLC/c16229
Published: October 2019
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to Carl Zeiss X-ray Microscopy LLC by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required