Automated Optical Inspection Systems

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TILBURG, Netherlands, Aug. 3, 2018 — Automated Optical Inspection SystemsMek PowerSpector BTL automated optical inspection systems from Marantz Electronics Ltd. offer synchronized inspection of the top and bottom side of printed circuit boards after reflow, wave, or selective soldering, and placement of surface-mount and through-hole technology components.

With nine cameras per side and both heads inspecting the board at the same time, you can expect fast inspections without the high-power lighting system of each head affecting the other inspection taking place. The elimination of flipping removes potential for stress on the assembly and improves long-term reliability of solder joints. The GTAz-based bottom side inspection head has a clearance of 30 mm from the board surface. An additional Z axis allows the head to be adjusted by 30 mm to allow optimal flexibility for inspection inside solder frames and the correct adjustment of side cameras to further enhance defect identification capabilities.

The 18.75-μm resolution of the main optics and the 13-μm resolution of the side cameras also give the option for 01005-in. surface-mount device inspection including height verification of objects like pins and packages, and also 3D chip height measurement.

Published: August 2018
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ProductsMekPowerSpector BTL AOIautomated optical inspection systemsOpticsMarantz ElectronicsEurope

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