Automated Wafer-level PIC Test

ficonTEC Service GmbH

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One of the remaining frontiers in photonics assembly and test is volume-capable, mixed-signal electro-optical testing. ficonTEC’s new Wafer-level Test (WLT) product line is specially designed as a versatile, fully automated test & measurement system platform for on-wafer device test, for example, of on-wafer optical elements, PICs and hybrid opto-electronic devices. ficonTEC’s WLT systems address the growing demand within the integrated photonics eco-system for advanced assembly and test systems that are compatible with the rapid progress being made in device complexity, component assembly technology and the commensurate requirements for new test approaches – as far as possible, all at wafer level.

Device wafers are held in place on a temperature stabilized wafer chuck. Automated system referencing functions draw on the standard integrated, high-resolution machine vision system for device referencing, recognition of contact pads and I/O ports, and OCR for device cataloging and tracking. Fast, high-precision motion system alignment to multiple optical ports ensures rapid, hands-off testing across entire wafers up to 12” in size.

When suitably equipped for GelPak and other die/chip handling formats, these systems also routinely undertake complex electro-optical testing of singulated PIC and chip devices. Both on-wafer and singulated devices can be either passively tested or actively driven, as required, and the electro-optical probe layout can be flexibly arranged to suit different contact/port configurations. The systems are driven by ficonTEC's user-friendly and widely popular PCM software, enabling processes and routines established during the development process to be seamlessly implemented within a production environment.

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