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C10650-461 X-Ray TDI Cameras

Hamamatsu CorporationRequest Info
 
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BRIDGEWATER, N.J., April 1, 2011 — An x-ray time delay integration (TDI) camera for nondestructive inspection and testing, the C10650-461 is a new addition to Hamamatsu Corp.’s line. While maintaining high sensitivity, the “no gap” camera’s TDI technology offers higher resolution than standard line-scan cameras produce, according to the company.

It is suitable for high-throughput inspections that require high sensitivity and high resolution, such as inspection of printed circuit boards, electronic assemblies with ball grid arrays and other surface-mounted components, batteries and pharmaceuticals.

The camera features a TDI CCD image sensor with 6144 × 128 pixels coupled with a CsI scintillator. Each pixel measures 48 × 48 µm, which is suitable for high-resolution imaging. The TDI line rate is 6 m/min at full resolution and 11 m/min with 2 × 2 binning. X-ray images are output as 16-bit data via a Camera Link interface, and dark current and shading corrections are performed in real time. The camera has a detection length of 292 mm and can be installed between conveyor belts for in-line inspection.

TDI imaging is appropriate for applications where a linear movement must be recorded, or where the aspect ratio of the subject being imaged is asymmetric.

The x-ray sensitive area measures 292 × 6 mm, and the window is a fiber optic plate with scintillator. X-ray detection range is ~25 to 85 kVp, and maximum x-ray tolerance range is 93.5 kVp at 50 W. Analog-to-digital gain value is 0 to 20 dB in 64-step increments.


Photonics.com
Apr 2011
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Americasball grid arraysBGAC10650-461Camera LinkcamerasCCDCsI scintillatorelectronic assemblieshamamatsuimagingin-line inspectionNew Jerseynondestructive inspectionnondestructive testingpharmaceuticalsprinted circuit boardsProductsSensors & Detectorssurface-mounted componentsTDITest & Measurementx-ray time delay integration camera

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