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C2M Interconnect

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IRVINE, Calif., Sept. 27, 2024 — TeraSignal C2M InterconnectThe TSLink from TeraSignal is an intelligent chip-to-module (C2M) interconnect for data transmission between large ASICs and linear optical modules. The interconnect can interface with existing ASICs for connection with various types of linear optics such as linear pluggable optics, near package optics, co-packaged optics, and active copper cables. The TSLink is designed to be agnostic to protocols (Ethernet, PCIe, InfiniBand, etc.), modulation schemes (NRZ, PAM4, etc.) and media (fiber, copper) and features a lower bit error rate and reduced power consumption.



Published: September 2024
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Productsfiber opticsinterconnectslinear opticsAIdata centersCommunicationsindustrialdata transmissionchipsAmericasTeraSignal

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