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CHRocodile IT Sensor System

Armstrong Optical Ltd.Request Info
 
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NORTHAMPTON, England, Aug. 1, 2011 — A noncontact high-precision sensor that provides thickness measurement of infrared silicon and other semiconductor substrate wafers, doped or undoped, has been unveiled by Precitec Optronik and is available through Armstrong Optical Ltd.

The CHRocodile IT sensor system is based on laser diode technology and offers thickness measurement in the range from 18 µm to 3 mm in air, with a resolution of better than 60 nm for silicon. It performs in-line measurements at a 4-kHz sampling rate and can operate in a vacuum. Measurement is independent of variations in temperature and atmospheric moisture, making the system suitable for many industrial applications.

The easily integrated sensor head measures <20 mm in diameter and is <50 mm long, and it comprises a passive lens system with no electronic components or moving parts. It is attached to the controller via a fiber optic cable, rendering measurement immune to electronic interference.

The sensor accommodates multilayer systems and can be configured with up to five sensor heads for multichannel analysis.

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Photonics.com
Aug 2011
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Armstrong OpticalCHRocodile IT sensor systemdoped wafer thickness measurementEnglandEuropein-line wafer thickness measurementindustrialinfrared silicon wafer thickness measurementnoncontact thickness measurementpassive lens systemPrecitec OptronikProductssemiconductor substrate wafer thickness measurementSensors & DetectorsTest & Measurementundoped wafer thickness measurement

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