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Fixed abrasive slicing technology equipment has been designed by Crystal Systems for use in the optics, optoelectronics and semiconductor industries. The machines employ a fixed diamond abrasive on wire for fast and precise slicing. They feature speeds up to 5000 rpm and minimum contact length with the wires, increasing the pressure between the diamond particles and the workpiece. Crystals are sliced into wafers using a diamond-plated wire pack made by Saint-Gobain Abrasives. Crystal Systems says that the slicer is suitable for cutting sapphire, silicon carbide, silicon and other expensive materials.

Photonics Spectra
Oct 2003

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abrasive slicing technology equipmentcrystal systemsdiamond abrasivediamond-plated wire packindustrialNew ProductsSemiconductor Industries

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