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Circuit/Chip Packaging Platform

Advanced Semiconductor Engineering Inc. (ASE)Request Info
 
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SUNNYVALE, Calif., June 20, 2022 — Circuit/Chip Packaging PlatformThe VIPack packaging platform from Advanced Semiconductor Engineering Inc. is designed to enable vertically integrated package solutions.

The platform leverages advanced redistribution layer processes, embedded integration, and 2.5D and 3D technologies when integrating multiple chips within a single package. The six core packaging technology pillars include high-density, RDL-based Fanout Package-on Package (FOPoP); Fanout Chip-on-Substrate, (FOCoS); Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge); Fanout System-in-Package (FOSiP); and Through Silicon Via (TSV)-based 2.5D, 3D integrated circuit and co-packaged optics processing capabilities.


Photonics.com
Jun 2022
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ProductsVIPackCircuit/Chip Packaging PlatformAdvanced Semiconductor EngineeringsemiconductorsopticssiliconindustrialCommunicationsautomotiveAmericas

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