Cleaning Technology

3D-Micromac AGRequest Info
Facebook X LinkedIn Email
Clean Scribe technology from 3D-Micromac AG is a feature for its microDICE laser micromachining system that enables particle-free scribing of silicon carbide (SiC) wafers without the need for expensive coatings and without impacting wafer dicing throughput.

Clean Scribe works seamlessly with 3D-Micromac's TLS-Dicing (thermal-laser-separation) process with integraton in the microDICE system to provide fast, damage-free, and cost-effective wafer dicing with no additional material or equipment overhead.

Clean Scribe replaces the dry scribe approach with an aerosol spray that uses an extremely small amount of deionized water to wash away the particles during the laser processing step. The technology provides dicing speeds of up to 300 mm/s.

Published: April 2018
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:

When you click "Send Request", we will record and send your personal contact information to 3D-Micromac AG by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required

ProductsClean Scribecleaning technology3D-MicromacMaterialsEurope

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.
Vision Spectra Conference 2024LIVE NOW: 3D Imaging of Transparency: The Next Frontier in Automated Item Picking X