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3-D Optical Microscope

Bruker Nano SurfacesRequest Info
 
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Bruker Corp. has launched the ContourSP, a large-panel 3-D metrology system for gauging individual layers of printed circuit board (PCB) panels during manufacturing.

Based on white-light interferometry, the technology is designed to enable minimum recipe development time, maximum uptime, and increased measurement throughput of high-density interconnect substrates in multichip modules.

The system features the proprietary Vision64 operating and analysis software.


Published: December 2013
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3-D metrologyAmericasArizonaBiophotonicsBrukerContourSPhigh-density interconnectindustrialmachine visionmetrologyMicroscopymultichip moduleOpticsPCB manufacturingprinted circuit boardsProductssemiconductorsTest & MeasurementVision64

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