3-D Optical Microscope

Bruker Nano SurfacesRequest Info
Facebook X LinkedIn Email
Bruker Corp. has launched the ContourSP, a large-panel 3-D metrology system for gauging individual layers of printed circuit board (PCB) panels during manufacturing.

Based on white-light interferometry, the technology is designed to enable minimum recipe development time, maximum uptime, and increased measurement throughput of high-density interconnect substrates in multichip modules.

The system features the proprietary Vision64 operating and analysis software.

Published: December 2013
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:

When you click "Send Request", we will record and send your personal contact information to Bruker Nano Surfaces by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required

Photonics Marketplace
Looking for Substrates? There are 54 companies listed in the Photonics Buyers' Guide.
Browse Cameras & Imaging, Lasers, Optical Components, Test & Measurement, and more.
3-D metrologyAmericasArizonaBiophotonicsBrukerContourSPhigh-density interconnectindustrialmachine visionmetrologyMicroscopymultichip moduleOpticsPCB manufacturingprinted circuit boardsProductssemiconductorsTest & MeasurementVision64

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.