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DSH-355-25 UV Laser

Photonics Industries International Inc.Request Info
 
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BOHEMIA, N.Y., March 6, 2014 — Photonics Industries has released the DSH-355-25 high-power UV laser for micromachining applications such as flexible printed circuit board cutting and wafer scribing.

The laser delivers up to 30 W of intracavity harmonic average power at 355 nm. Its intracavity UV generation technology features nonconsumable THG crystals that require no crystal indexing, while the laser’s simpler optical resonator improves stability and insensitivity to ambient temperature changes.


Published: March 2014
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AmericasConsumerindustrialmicromachiningNew YorkOpticsPhotonics IndustriesProductswafer scribingWafersDSH-355-25 UV laserflexible printed circuit board cuttingflexible PCB cuttingTHG crystalsLasers

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