Development Kit
D3 EngineeringRequest Info
The DesignCore® RVP-TDA4Vx Development Kit from D3 Engineering features a rugged electronic control unit to accelerate product design for advanced driver assistance and autonomous systems through production.
The production-intent kit features Texas Instrument’s TDA4VM system-on-chip processor and configurable SerDes interface. The configurable baseboard supports multiple SerDes capture streams with different transport protocols through its configurable personality card. The default card supports eight 4-Gbps FPD-Link™ III channels. The video outputs feature FPD-Link™ III technology and Display Port MST technology, supporting up to four serial displays.
In addition to automotive uses, other applications include autonomous guided vehicles, industrial vehicle systems, high-MP cameras, safety- and security-critical systems, sensor fusion, cameras, radar, ultrasonic, and lidar.
https://www.d3engineering.com
https://www.photonics.com/Buyers_Guide/D3_Engineering/c18044
Photonics Spectra
Apr 2020