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Die-to-Wafer Bonding Activation Solution

EV Group (EVG)Request Info
 
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ST. FLORIAN, Austria, Jan. 22, 2021 — Die-to-Wafer Bonding Activation SolutionThe EVG®320 D2W die preparation and activation system from EV Group GmbH is a hybrid die-to-wafer bonding activation solution designed to speed the deployment of 3D heterogeneous integration.

Providing seamless integration with third-party die bonders, the system incorporates all critical pre-processing modules needed for D2W bonding including cleaning, plasma activation, die alignment verification, and other essential metrology applications. It can be operated as a standalone or integrated system.

It enables new generations of devices and systems such as high-bandwidth memory, logic-on-memory, chiplets, segmented and 3D system on chip devices, and 3D stacked backside illuminated CMOS image sensors.

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Jan 2021
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