Die-to-Wafer Bonding Activation Solution
EV Group (EVG)Request Info
ST. FLORIAN, Austria, Jan. 22, 2021 — 
The EVG®320 D2W die preparation and activation system from EV Group GmbH is a hybrid die-to-wafer bonding activation solution designed to speed the deployment of 3D heterogeneous integration.
Providing seamless integration with third-party die bonders, the system incorporates all critical pre-processing modules needed for D2W bonding including cleaning, plasma activation, die alignment verification, and other essential metrology applications. It can be operated as a standalone or integrated system.
It enables new generations of devices and systems such as high-bandwidth memory, logic-on-memory, chiplets, segmented and 3D system on chip devices, and 3D stacked backside illuminated CMOS image sensors.
https://www.evgroup.com
https://www.photonics.com/Buyers_Guide/EV_Group_EVG/c4622
Photonics.com
Jan 2021