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Die Bonder

MRSI MycronicRequest Info
 
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TEWKSBURY, Mass., Aug. 3, 2022 — The MRSI-H-HPLD+ die bonder from MRSI Systems is tailored for high-power laser die attachment applications.

Improving throughput by using parallel processing, the die bonder is a variant of the MRSI-H-HPLD model. It can be used in high-mix, high-volume flexible manufacturing, maintaining high accuracy and flexibility.



Published: August 2022
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