Die Bonders
MRSI MycronicRequest Info
The MRSI-H1 and MRSI-HVM1 die bonders from MRSI Systems provide 1-µm machine accuracy for use in mass manufacturing of silicon photonics, lidar, and more.
The devices combine accuracy, speed, and flexibility to reduce cost, improve production agility, and increase return-of-investment. They are developed from the MRSI-H/MRSI-HVM platforms.
https://www.mrsisystems.com
/Buyers_Guide/MRSI_Mycronic/c31792
Published: October 2022
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to MRSI Mycronic by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required