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Die Bonders

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The MRSI-H1 and MRSI-HVM1 die bonders from MRSI Systems provide 1-µm machine accuracy for use in mass manufacturing of silicon photonics, lidar, and more.

The devices combine accuracy, speed, and flexibility to reduce cost, improve production agility, and increase return-of-investment. They are developed from the MRSI-H/MRSI-HVM platforms.

Photonics Spectra
Dec 2022
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ProductsMRSI-H1MRSI-HVM1die bondersMRSI Systemsmachine visionlidarSensors & DetectorslasersindustrialAmericas

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