EP21FL Epoxy System
Master Bond Inc.Request Info
HACKENSACK, N.J., March 15, 2010 – Master Bond Inc.’s is a two-part epoxy resin system that features low to moderate viscosity. It is suitable for potting, coating and sealing electronic assemblies and for bonding dissimilar substrates with different coefficients of expansion.
Typical viscosity of Part A (clear) is 4000 cyles/s and, of Part B (amber), 10,000 cycles/s, at 25 ºC. The system produces strong castings, bonds and seals that are resistant to thermal cycling and shock. Its bond strength is >1500 lb/sq in., and its tensile strength is >1100 lb/sq in. The hardened compound is an electrical insulator and is available in ½-pint, pint, quart, and 1- and 5-gallon container kits.
It cures at room temperature and, more quickly, at elevated temperatures, with a 4:1 mix ratio by weight. It is 100% reactive and contains no solvents or other volatiles.
https://www.masterbond.com
/Buyers_Guide/Master_Bond_Inc/c9086
Published: March 2010
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to Master Bond Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required