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EP30FLAO Low-Viscosity Epoxy

Master Bond Inc.Request Info
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HACKENSACK, N.J., Aug. 30, 2010 — Master Bond Inc.’s EP30FLAO is a two-component epoxy resin system for potting, bonding, sealing and coating. It can be used in a variety of cryogenic applications.

This low-viscosity epoxy with good flow characteristics makes it a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer are required.

It is formulated to cure at room temperature or, more rapidly, at elevated temperatures, with a 10:1 mix ratio by weight. It is an effective adhesive/sealant that forms durable and flexible bonds that are resistant to thermal cycling and to chemicals including water, oil and most organic solvents.

Service temperature range is from -51 to 121 ºC. Thermal conductivity is 9 to 10 BTU/in/ft²/hr/º F. The viscosity of the mixed compound is 5000 to 6000 centipoise at 24 º C. The epoxy has a low thermal expansion coefficient, good dimensional stability, and good physical strength and toughness.

Parts A and B are available in half-pint, pint, quart, and 1- and 5-gal containers.
Aug 2010

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1-gal5-galAmericasapplianceBiophotonicsbondingchemicalchemicalscoatingscomputercryogenicelectricalelectronicselevated temperatureEP30FLAOepoxyhalf-pintlow-viscosityMaster BondmetalworkingpintpottingProductsquartresinroom temperaturesealingthermally conductivetwo-component

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