EPOXY ADHESIVE
Master Bond Inc.Request Info
A two-component epoxy adhesive/sealant for cryogenic applications has been released by Master Bond Inc. The EP29LPSP compound withstands temperatures as low as 4 K and resists cryogenic shocks, such as a drop from room temperature to liquid helium temperatures in a 5- to 10-min period. The optically clear substance has a mix ratio of 100:65 by weight. Although it cures at room temperature, optimal results are achieved if it is heat-cured at 130 to 165 °F. It bonds well to a variety of substances, including metals, glass, ceramics and plastics. When curing, it has a low exotherm. Its mixed viscosity is 400 cps. It has a tensile strength of 6500 psi and a tensile modulus of >375,000 psi.
https://www.masterbond.com
/Buyers_Guide/Master_Bond_Inc/c9086
Published: July 2008
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to Master Bond Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required