Electro-Optical Wafer-Level Test Solution
ficonTEC Service GmbHRequest Info
ACHIM, Germany, July 2, 2025 — Developed in collaboration with automated test equipment (ATE) manufacturers including Teradyne and Advantest, ficonTEC’s single-sided electro-optical wafer-level tester is designed for high-volume electro-optical testing of silicon photonics products used in AI communication fabrics as well as high-performance computing applications. The test cell has precise optical I/O active alignment probing from the same top side of the wafer as the electrical probe card interface from the automated test equipment ATE. The tester is fully integrated at both the software and hardware levels. It supports DC and high-speed signal testing, automated wafer handling, chuck thermal control, advanced wafer mapping, and optical I/O port recognition.
https://www.ficontec.com
/Buyers-Guide/ficonTEC-Service-GmbH/c4926
Published: July 2025
From the Photonics Marketplace
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