Master Bond Inc.Request Info
Facebook X LinkedIn Email
Master Bond Inc. has developed a two-part, silver-filled, electrically conductive adhesive that cures rapidly at room temperature. The Model EP77M-F compound has a one-to-one mix ratio and can set up in ambient temperatures within 5 to 7 min, even when mixed in very small amounts. It features a high bond strength of 1500 psi tensile shear when fully cured at room temperature. The adhesive does not contain any diluents or solvents, and bonds are resistant to oil, water and most organic solvents.

Published: March 1997
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:

When you click "Send Request", we will record and send your personal contact information to Master Bond Inc. by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required

MaterialsNew Products

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.