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FISBA READYBeam™

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SPIE Photonics West 2020 Booth: 763

FISBA READYBeam™At Photonics West 2020 FISBA will be presenting their latest development: the FISBA READYBeam, a «ready to go» compact, powerful, and reliable multi-wavelength laser source. This laser module will expand the features and functions of business and research significantly. It is the instrument designers' first choice to dramatically reduce the footprint, development time, and integration risk. The unit will be available in two primary configurations: the READYBeambio and READYBeamind.


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