Close

Search

Search Menu
Photonics Media Photonics Marketplace Photonics Spectra BioPhotonics EuroPhotonics Vision Spectra Photonics Showcase Photonics ProdSpec Photonics Handbook

FLIP-CHIP MATERIAL

Henkel Electronic Materials LLCRequest Info
 
Facebook Twitter LinkedIn Email Comments
Hysol FP4548FC is a high-purity liquid epoxy encapsulant material from Henkel Corp.’s Electronics Div. that is designed as an underfill for flip-chip devices that require crack and fracture resistance. Its low coefficient of thermal expansion and low shrinkage properties make it suitable for low k die applications. When fully cured, the material creates a rigid, high-strength seal that dissipates solder joint stress, extends thermal cycling performance and simplifies assembly. It is compatible with lead-free manufacturing requirements and is qualified for JEDEC Level 3/260 °C.


Photonics Spectra
Nov 2005
REQUEST INFO ABOUT THIS PRODUCT

* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address:
Address 2:
City:
State/Province:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required

When you click "Send Request", we will record and send your personal contact information to Henkel Electronic Materials LLC by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.
Henkel Corp.high-purity liquid epoxy encapsulant materialHysolindustrialNew Products

back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2020 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, [email protected]

Photonics Media, Laurin Publishing
x Subscribe to Photonics Spectra magazine - FREE!
X
Are you interested in this product?
When you click "Send Request", we will send the contact details you supply to Henkel Electronic Materials LLC so they may respond to your inquiry directly.

Email Address:
Name:
Company:
Stop showing me this for the remainder of my visit
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.