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Hamamatsu Corp. - Earth Innovations LB 2/24

Fan-Out-Package-on-Package

Advanced Semiconductor Engineering Inc. (ASE)Request Info
 
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The Fan-Out-Package-on-Package (FOPoP) solution from Advanced Semiconductor Engineering Inc. is designed to lower latency and deliver bandwidth advantages for the dynamic mobile and networking markets.

Positioned under the VIPack platform, FOPoP reduces the electrical path by 3× and enables bandwidth density by up to 8×, allowing engine bandwidth expansion up to 6.4 Tbps/unit. Interconnect capabilities, proximity driven impedance enhancements, stacked vias, and vertical coupling enablement drive the vertical integration methodology used in the FOPoP structure. Applications include next-generation solutions for processors, antenna-in-package devices, and silicon photonics uses.


Published: March 2023
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ProductsFan-Out-Package-on-PackageFOPoPAdvanced Semiconductor EngineeringCommunicationssiliconAmericas

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