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Flexible Printed Circuit Board Laser Processing System
Nov 2018
Electro Scientific Industries Inc. (ESI)Request Info
PORTLAND, Ore., Nov. 15, 2018 — Flexible Printed Circuit Board Laser Processing SystemThe CapStone flexible printed circuit board (PCB) laser processing system from Electro Scientific Industries Inc. offers 2× throughput improvement over its predecessor for processing blind and through hole vias.

CapStone helps manufacturers keep pace with evolving technology requirements such as the increasing use of blind vias and next-generation flexible materials. The DynaClean beam positioning feature, enabled by patented esiLens technology, reduces unproductive beam movement and provides multiple focus settings at every location. AcceleDrill beam positioning technology takes advantage of the high power and high repetition rate of the esiFlex laser to deliver unprecedented processing efficiency.

These technologies allow flexible printed circuit manufacturers to double their processing throughput without compromising quality, substantially lowering per-panel processing costs while maintaining high yields across a range of applications.


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Electro Scientific Industries
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