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Flip-Chip Bonder

SET Smart Equipment TechnologyRequest Info
 
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SAINT-JEOIRE, France, Dec. 9, 2019 — Flip-Chip BonderThe NEO HB automatic flip-chip bonder from Smart Equipment Technology Corp. SA is designed for ± 1-µm, 3-σ post-bonding accuracy in standalone or full automatic mode.

The system is suitable for direct hybrid bonding processes. The first of a new line dedicated entirely to production, the bonder combines high precision, flexibility, short cycle time, and creative design.

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Dec 2019
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