Flip-Chip Bonders
SET Corp. SARequest Info
ACCμRA flip-chip bonders from Smart Equipment Technology SA are dedicated to production for optoelectronic and silicon photonics applications.
The ACCμRA Plus is designed for ± 0.5-μm post-bond accuracy in fully automatic mode and is suitable for reflow and thermocompression processes by combining high precision, flexibility, and short cycle time.
The ACCμRA OPTO also allows ± 0.5-μm post-bond accuracy, but is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of the process. The ACCμRA OPTO combines high precision, flexibility, and accessibility.
http://www.set-sas.fr
/Buyers_Guide/SET_Corp_SA/c17227
Published: February 2020
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:
When you click "Send Request", we will record and send your personal contact information to SET Corp. SA by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our
Privacy Policy and
Terms and Conditions of Use.
Register or login to auto-populate this form:
Login
Register
* Required