Search Menu
Photonics Media Photonics Marketplace Photonics Spectra BioPhotonics Vision Spectra Photonics Showcase Photonics ProdSpec Photonics Handbook
Gentec Electro-Optics Inc. - Miro by Gentec E-O

Flip-Chip Bonders

SET Corp. SARequest Info
Facebook Twitter LinkedIn Email
SAINT-JEOIRE, France, Feb. 25, 2020— Flip-Chip BondersACCμRA flip-chip bonders from Smart Equipment Technology SA are dedicated to production for optoelectronic and silicon photonics applications.

The ACCμRA Plus is designed for ± 0.5-μm post-bond accuracy in fully automatic mode and is suitable for reflow and thermocompression processes by combining high precision, flexibility, and short cycle time.

The ACCμRA OPTO also allows ± 0.5-μm post-bond accuracy, but is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of the process. The ACCμRA OPTO combines high precision, flexibility, and accessibility.
Feb 2020

* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address 2:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required

When you click "Send Request", we will record and send your personal contact information to SET Corp. SA by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.
ProductsACCµRAflip-chip bondersACCµRA PlusACCµRA OPTOsiliconopticsoptoelectronicsEurope

back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2022 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, [email protected]

Photonics Media, Laurin Publishing
x We deliver – right to your inbox. Subscribe FREE to our newsletters.
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.