Flip-Chip Bonders
SET Corp. SARequest Info
SAINT-JEOIRE, France, Feb. 25, 2020— 
ACCμRA flip-chip bonders from Smart Equipment Technology SA are dedicated to production for optoelectronic and silicon photonics applications.
The ACCμRA Plus is designed for ± 0.5-μm post-bond accuracy in fully automatic mode and is suitable for reflow and thermocompression processes by combining high precision, flexibility, and short cycle time.
The ACCμRA OPTO also allows ± 0.5-μm post-bond accuracy, but is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of the process. The ACCμRA OPTO combines high precision, flexibility, and accessibility.
http://www.set-sas.fr
https://www.photonics.com/Buyers_Guide/SET_Corp_SA/c17227
Photonics.com
Feb 2020