Flip-Chip Bonders

SET Corp. SARequest Info
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SAINT-JEOIRE, France, Feb. 25, 2020— Flip-Chip BondersACCμRA flip-chip bonders from Smart Equipment Technology SA are dedicated to production for optoelectronic and silicon photonics applications.

The ACCμRA Plus is designed for ± 0.5-μm post-bond accuracy in fully automatic mode and is suitable for reflow and thermocompression processes by combining high precision, flexibility, and short cycle time.

The ACCμRA OPTO also allows ± 0.5-μm post-bond accuracy, but is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of the process. The ACCμRA OPTO combines high precision, flexibility, and accessibility.

Published: February 2020
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ProductsACCµRAflip-chip bondersACCµRA PlusACCµRA OPTOsiliconOpticsoptoelectronicsEurope

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