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Flip Chip Bonder

Shibuya Corp.Request Info
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KANAZAWA, Japan, Oct. 9, 2020 — Flip Chip BonderThe FDB210P Flip Chip Bonder from Shibuya Corp. can be used for the mass production of optical devices and semiconductors that require sub-μm level of bonding accuracy.

The system is able to handle microchips of up to 0.15 sq. mm, achieving high-accuracy alignment within sub-μm post bonding. Its highly rigid frame is hardly affected by temperature fluctuation, and full-closed axes control enables accurate alignment. These features maintain high-accuracy bonding performance stability.

The bonding process for multiple chips can be easily achieved by high-speed pulse heaters equipped on the bond head and bond stage. A unique post-bonding N2 purge mechanism and monitoring function stabilize bondability.
Oct 2020

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ProductsFlip Chip BonderFDB210PShibuyaopticssemiconductorsindustrialAsia-Pacific

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