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Gap Filler Material

Shin-Etsu Silicones of AmericaRequest Info
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AKRON, Ohio, March 19, 2018 — Shin-Etsu Silicones of America Inc. has announced the CLG series of single-component, precured Gap Filler products.

The materials are ideal for a broad base of general electronics cooling applications, offering a wide range of thermal conductivity. The one-component CLG Gap Filler greases are simpler to use, requiring no mixing or use of a two-part meter-mix equipment system. Notably, the material does not need to cure after it is dispensed so there is no time-consuming waiting or heating involved to cure after dispensing—and no resulting curing process byproducts. The materials offer a low volatile content with excellent resistance to pump-out and creeping.

Featuring a gel-like consistency, the material is applicable on a myriad of surface shapes, easily filling voids between heat sources and heat sinks. By displacing the air from these nooks and crannies, a lower thermal resistance is achieved. Notably, the CLG Gap Filler material can be applied only where you need it, thereby minimizing waste. The materials can also be reworked because they do not adhere to substrates. The soft material’s low hardness minimizes stress on delicate electronic components. Additionally, the viscosity allows for ease of dispensing and reduced process times without any unique storage requirements.
Mar 2018

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