Glass Carrier Wafers

Corning Inc., Advanced OpticsRequest Info
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CORNING, N.Y., June 23, 2022 — Ultralow Total Thickness Variation (TTV) Glass Carrier Wafers from Corning Inc. enable advanced semiconductor manufacturing and 5G connectivity applications.

With a <0.2-µm TTV, critical for manufacturing more advanced semiconductor chips, the devices allow for better process control and support during temporary bonding and wafer-thinning processes used in the stacking and packaging of integrated circuits. The carriers are available in a wide range of thermal expansion coefficients to meet challenging requirements in R&D and mass production.

Published: June 2022
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