Search
Menu

Glass Carrier Wafers

Corning Inc., Advanced OpticsRequest Info
 
Facebook X LinkedIn Email
CORNING, N.Y., June 23, 2022 — Ultralow Total Thickness Variation (TTV) Glass Carrier Wafers from Corning Inc. enable advanced semiconductor manufacturing and 5G connectivity applications.

With a <0.2-µm TTV, critical for manufacturing more advanced semiconductor chips, the devices allow for better process control and support during temporary bonding and wafer-thinning processes used in the stacking and packaging of integrated circuits. The carriers are available in a wide range of thermal expansion coefficients to meet challenging requirements in R&D and mass production.



Published: June 2022
REQUEST INFO ABOUT THIS PRODUCT
* First Name:
* Last Name:
* Email Address:
* Company:
* Country:
Message:


When you click "Send Request", we will record and send your personal contact information to Corning Inc., Advanced Optics by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.

Register or login to auto-populate this form:
Login Register
* Required

ProductsUltra-low Total Thickness Variation Glass Carrier WafersUltra-low TTV Glass Carrier WafersCorningOpticsWafersR&DindustriasemiconductorsCommunicationsAmericasUltralow total thickness variation glass carrier wafersUltralow TTV glass carrier wafers

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.